Usage
Drilling blind holes, vias in HDI board, blind cut and blind slot in rigid-flex board. Cutting a variety of FPC and cover layer, low carbonization. Cutting FPC and copper substrate thickness up to 1 mm, smooth appearance. Precisely etching of functional film. Cutting the base material.
CHARACTERISTIC
1. Safe and reliable. Fully enclosed design, automatic control of worktable door to ensure safe operation;
2. Automation. Auto focus, auto-correction, auto-positioning, auto-homing, automatic spot compensation, and intelligent design;
3. Energy measuring. Automatically measure energy on the samples;
4. High drilling / cutting precision. Using ultra-high-precision scanning galvanometer, fully guaranteed drilling, cutting accuracy and quality;
5. Multi-panels cutting. With function to cutting array panels;
6. Optical optimization. High peak power and high pulse energy, fine focal spot, ensure cutting and drilling with high speed and high precision;
7. Convenient operation. Drilling and cutting with independent module, easy conversion;
8. Optimize design. Optimization of laser processing path function, reduce processing time and improve efficiency.
Drilling blind holes, vias in HDI board, blind cut and blind slot in rigid-flex board. Cutting a variety of FPC and cover layer, low carbonization. Cutting FPC and copper substrate thickness up to 1 mm, smooth appearance. Precisely etching of functional film. Cutting the base material.
CHARACTERISTIC
1. Safe and reliable. Fully enclosed design, automatic control of worktable door to ensure safe operation;
2. Automation. Auto focus, auto-correction, auto-positioning, auto-homing, automatic spot compensation, and intelligent design;
3. Energy measuring. Automatically measure energy on the samples;
4. High drilling / cutting precision. Using ultra-high-precision scanning galvanometer, fully guaranteed drilling, cutting accuracy and quality;
5. Multi-panels cutting. With function to cutting array panels;
6. Optical optimization. High peak power and high pulse energy, fine focal spot, ensure cutting and drilling with high speed and high precision;
7. Convenient operation. Drilling and cutting with independent module, easy conversion;
8. Optimize design. Optimization of laser processing path function, reduce processing time and improve efficiency.
| ITEM | SPECIFICATION |
| MODEL | JG16 |
| Laser Source | UV,355nm All-solid-state UV laser device, wavelength 355nm |
| Laser Power | 8W/30KHz |
| Laser Frequency | 30-120KHz |
| Maximum Processing Size | 500x400mm(Double working table) |
| Platform Maximum Operating Speed | 24m/min |
| Platform Maximum Positioning Accuracy | ±5µm |
Platform Maximum Repeat Positioning Accuracy | ±2µm |
| System Processing Precision | ±25µm |
| Cutting Line Width | 20±5µm |
| Cutting Thickness | <1.0mm |
| File format | Gerber & .DXF & .lay,G(CAM)Standard G code(Can switch via CAM) |
| Power | AC220V 50Hz/2.5KW,AC380V 50Hz/5.5KW |
| Vacuuming Requirements | 516m³/h |
| Overall Dimensions | 1780x1680x1560mm |
| Weight | 2500Kg |
| Environmental Temperature | 20±2° |
| Environmental Humidity | <60%RH No dew |
| Ground Amplitude | <5µm |
| Ground Pressure | >1000kgf/m² |
| ,/ Industry-specific control machine, with computer pre-installed drilling and cutting software | Motion controller and industrial personal computer control mode 17,300G Equipped with 17"screen,300G hard disk |
