UV laser marking machine
Product synopsis:
Laser marking machine uses high density energy of laser beam working on workpiece's surface, so that the surface material is rapidly vaporized or color changed, thereby exposing the deep material or creating permanent marks causing by chemical changes, or through laser energy burns some material of the workpiece, showing the required etching graphics, text, etc.
Product features:
1. UV laser marking machine is with cold light source, so heat effect zone of laser cutting or laser marking is small. UV laser is more suitable for sensitive material to heat effect of further processing.
2. UV laser is with a narrower pulse and higher peak power, which is easy to break through the damage threshold of sapphire ceramic material, so it is easy to process those with high damage threshold molecular materials.
3. The minimum focus spot of UV laser can achieve 15um, so it very suits for micro drilling.
Application field:
UV laser marking machine is suitable for working on many kinds of items, like consumer electronics, mobile phone parts, LCD screen and trademark two-dimensional code carving, ceramics, sapphire piece, FPC flexible circuit board micro drilling, cutting biomedical glass engraved lines, capacitive touch screen ITO etching.
Product synopsis:
Laser marking machine uses high density energy of laser beam working on workpiece's surface, so that the surface material is rapidly vaporized or color changed, thereby exposing the deep material or creating permanent marks causing by chemical changes, or through laser energy burns some material of the workpiece, showing the required etching graphics, text, etc.
Product features:
1. UV laser marking machine is with cold light source, so heat effect zone of laser cutting or laser marking is small. UV laser is more suitable for sensitive material to heat effect of further processing.
2. UV laser is with a narrower pulse and higher peak power, which is easy to break through the damage threshold of sapphire ceramic material, so it is easy to process those with high damage threshold molecular materials.
3. The minimum focus spot of UV laser can achieve 15um, so it very suits for micro drilling.
Application field:
UV laser marking machine is suitable for working on many kinds of items, like consumer electronics, mobile phone parts, LCD screen and trademark two-dimensional code carving, ceramics, sapphire piece, FPC flexible circuit board micro drilling, cutting biomedical glass engraved lines, capacitive touch screen ITO etching.
| Mode | JJCF-DY |
| Average power | 0.5W,1W,3W,5W,8W,10W |
| Wavelength | 355nm |
| Standard machine aera | 100mm×100mm |
| Machine Power | 800W |
| Min.Linewidth | 0.005mm |
| Positioning accuracy | ±0.003mm |
| Power supply | 220V 50/60HZ |
| Marking speed | 7000mm/s |
| Format supported | JPG,PCX,PLT,BMP,DXF |
